Advanced Packaging
Advanced packaging for semiconductors is a cutting-edge approach to integrating and interconnecting multiple chips or components within a single package, enabling higher performance, reduced power consumption, and more compact designs. Unlike traditional packaging, which focuses on enclosing a single die, advanced packaging employs techniques such as chiplet integration, 2.5D and 3D stacking, and system-in-package (SiP) solutions. These methods facilitate shorter interconnects, improved thermal management, and enhanced signal integrity.
Advanced packaging for semiconductors is a cutting-edge approach to integrating and interconnecting multiple chips or components within a single package, enabling higher performance, reduced power consumption, and more compact designs. Unlike traditional packaging, which focuses on enclosing a single die, advanced packaging employs techniques such as chiplet integration, 2.5D and 3D stacking, and system-in-package (SiP) solutions. These methods facilitate shorter interconnects, improved thermal management, and enhanced signal integrity.
By leveraging technologies like through-silicon vias (TSVs) and fan-out wafer-level packaging (FOWLP), advanced packaging supports the growing demand for heterogeneous integration, making it crucial for applications in artificial intelligence, 5G, IoT, and high-performance computing. This innovation is pivotal in overcoming the limitations of traditional scaling and driving progress in the semiconductor industry.
SHELLBACK addresses critical metal etch and polymer removal requirements of advanced packaging, providing customized solutions based on proven technology and excellent uniformity
UBM Wet Etch with Endpoint Detection
SAT for Metal Etch
End Point Detection
