SEMITOOL TORRENT SP Automated Batch Spray
SP
The TORRENT®SP is well-suited for those manufacturers who require an automated wet processing mini-environment in a compact footprint, including power semiconductor, CMOS IC, Advanced Packaging, MEMS, and LED applicationsThe main drivers for automation at 200mm and above is to reduce manual operator intervention and dependency. This provides ergonomic relief to operators, fulfills the automation requirements of SMIF and FOUP operations, and has the added advantage of automated wafer control.
Ideal for Advanced Packaging UBM Etch
SEMITOOL TORRENT®SP
Automated Batch Spray System
All the featrues of our industry-favorite batch spray systems along with front end FOUP / SMIF auto loading automation for high speed applications up to 300mm.
Process Applications
Clean
- RCA cleans
- Flux cleans
- Solvent polymer cleans
- Ozone post-DRIE clean
- Polymer removal
- Ozone Post-Ash cleans
- Fluorozone clean
- Post-Dice cleans
Etch
- Metal etch with advanced EPD
- Sequential UBM etch
- Silicon etch
- Oxide etch
- Glass etch
Our UBM Etch Technology
Minimizes Undercut
Improves Throughput
Resist Strip
- Hydrozone resist strip
- Hydrozone+ resist strip
- Solvent resist strip
- Sequential etch resist strip
Specifications
- Brooks Versaport Loadports with wafer mapping
- H-Square end effector for unloading and loading of loadports
- Dedicated linear robot for loading and unloading loadports and Guardian Carrier
- 2 to 4 Guardian Carriers - 25 or 50 Wafer loads
- Dedicated load and unload station for Guardian Carrier
- Staubli 6-Axis robot for dedicated loading and unloading of Guardian carriers in and out of Chambers
- Class 1 Mini Environment
- ULPA Filters
- Air Ionizer
- LED lighting
Features:
Chamber
- Automated spray batch up to 300mm wafers
- 25 or 50 wafer loads
- Automated Dry in and Dry out
- SMIF, FOUP and Cassette compatible
- Acid, Solvent and Ozone Processing
- Dual, Triple and Quad Configurations
- Advanced Industry Automation Components